Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Creep flow, diffusion, and electromigration in small scale interconnects

    New search for: Kim, D.
    New search for: Lu, W.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Creep flow, diffusion, and electromigration in small scale interconnects

    New search for: Kim, D.
    New search for: Lu, W.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Creep flow, diffusion, and electromigration in small scale interconnects

    New search for: Kim, D.
    New search for: Lu, W.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Creep flow, diffusion, and electromigration in small scale interconnects

    Contributors:

    Kim, D. (author) / Lu, W. (author)

    Published in:

    JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS ; 54 ; 2554-2568

    Publication date:

    2006-01-01

    Size:

    15 pages

    ISSN:

    0022-5096

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  530 / 620

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Electromigration in ULSI interconnects

    Tan, C. M. / Roy, A. | British Library Online Contents | 2007

    Electromigration and IC Interconnects

    Thompson, C. V. / Lloyd, J. R. | British Library Online Contents | 1993

    Challenges of electromigration - Electromigration degradation mechanisms in copper dual-inlaid interconnects -

    Zschech, E. / Meyer, M. A. / Grafe, M. et al. | British Library Online Contents | 2004

    Growth of electromigration-induced hillocks in Al interconnects

    Nucci, J. A. / Straub, A. / Bischoff, E. et al. | British Library Online Contents | 2002

    Damage mechanics of electromigration in microelectronics copper interconnects

    Basaran, Cemal / Lin, Minghui | British Library Online Contents | 2007

    Back to top