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    Interfacial reactions of Sn-Cu solder with Ni/Au surface finish on Cu pad during reflow and aging in ball grid array packages

    New search for: Islam, M. N.
    New search for: Chan, Y. C.

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    Interfacial reactions of Sn-Cu solder with Ni/Au surface finish on Cu pad during reflow and aging in ball grid array packages

    New search for: Islam, M. N.
    New search for: Chan, Y. C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Interfacial reactions of Sn-Cu solder with Ni/Au surface finish on Cu pad during reflow and aging in ball grid array packages

    New search for: Islam, M. N.
    New search for: Chan, Y. C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Title:

    Interfacial reactions of Sn-Cu solder with Ni/Au surface finish on Cu pad during reflow and aging in ball grid array packages

    Contributors:

    Islam, M. N. (author) / Chan, Y. C. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING B -LAUSANNE- ; 117 ; 246-253

    Publication date:

    2005-01-01

    Size:

    8 pages

    ISSN:

    0921-5107

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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