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A platform for research: civil engineering, architecture and urbanism
Experimental Reliability Estimation and Improvement for a Wafer Level Vacuum Packaged MEMS Device
Experimental Reliability Estimation and Improvement for a Wafer Level Vacuum Packaged MEMS Device
Experimental Reliability Estimation and Improvement for a Wafer Level Vacuum Packaged MEMS Device
Choi, M. S. (author) / Choa, S. H. (author) / Kim, Y.-J. / Bae, D.-H.
2005-01-01
6 pages
Article (Journal)
English
DDC:
620.11
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