Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Experimental Reliability Estimation and Improvement for a Wafer Level Vacuum Packaged MEMS Device
Experimental Reliability Estimation and Improvement for a Wafer Level Vacuum Packaged MEMS Device
Experimental Reliability Estimation and Improvement for a Wafer Level Vacuum Packaged MEMS Device
Choi, M. S. (Autor:in) / Choa, S. H. (Autor:in) / Kim, Y.-J. / Bae, D.-H.
01.01.2005
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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