Improved thermal stability and hole mobilities in a strained-Si/strained-Si1-yGey/strained-Si heterostructure grown on a relaxed Si1-xGex buffer: Fid-Bau Portal

Improved thermal stability and hole mobilities in a strained-Si/strained-Si1-yGey/strained-Si heterostructure grown on a relaxed Si1-xGex buffer

Gupta, S. / Lee, M. L. / Isaacson, D. M. / Fitzgerald, E. A.

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Improved thermal stability and hole mobilities in a strained-Si/strained-Si1-yGey/strained-Si heterostructure grown on a relaxed Si1-xGex buffer

Gupta, S. / Lee, M. L. / Isaacson, D. M. / Fitzgerald, E. A.

Improved thermal stability and hole mobilities in a strained-Si/strained-Si1-yGey/strained-Si heterostructure grown on a relaxed Si1-xGex buffer

Gupta, S. / Lee, M. L. / Isaacson, D. M. / Fitzgerald, E. A.

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Check availability in my library

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Document information

Title:

Improved thermal stability and hole mobilities in a strained-Si/strained-Si1-yGey/strained-Si heterostructure grown on a relaxed Si1-xGex buffer

Contributors:

Gupta, S. (author) / Lee, M. L. (author) / Isaacson, D. M. (author) / Fitzgerald, E. A. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING B -LAUSANNE- ; 124-125 ; 102-106

Publication date:

2005-01-01

Size:

5 pages

ISSN:

0921-5107

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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