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    Effects of Suspending Abrasives on the Lubrication Properties of Slurry in Chemical Mechanical Polishing of Silicon Wafer

    New search for: Liu, J. Y.
    New search for: Jin, Z. J.
    New search for: Guo, D. M.
    New search for: Kang, R. K.

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    Effects of Suspending Abrasives on the Lubrication Properties of Slurry in Chemical Mechanical Polishing of Silicon Wafer

    New search for: Liu, J. Y.
    New search for: Jin, Z. J.
    New search for: Guo, D. M.
    New search for: Kang, R. K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effects of Suspending Abrasives on the Lubrication Properties of Slurry in Chemical Mechanical Polishing of Silicon Wafer

    New search for: Liu, J. Y.
    New search for: Jin, Z. J.
    New search for: Guo, D. M.
    New search for: Kang, R. K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

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    Document information
    Title:

    Effects of Suspending Abrasives on the Lubrication Properties of Slurry in Chemical Mechanical Polishing of Silicon Wafer

    Contributors:

    Liu, J. Y. (author) / Jin, Z. J. (author) / Guo, D. M. (author) / Kang, R. K. (author)

    Published in:

    KEY ENGINEERING MATERIALS ; 304/305 ; 359-363

    Publication date:

    2006-01-01

    Size:

    5 pages

    ISSN:

    1013-9826

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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