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    The Design of a New Ultrasonic Horn for Flip-Chip Bonding

    New search for: Wang, W. C.
    New search for: Chen, S.
    New search for: Liu, C. H.
    New search for: Ni, C. Y.
    New search for: Lee, S.-B.
    New search for: Kim, Y.-J.

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    The Design of a New Ultrasonic Horn for Flip-Chip Bonding

    New search for: Wang, W. C.
    New search for: Chen, S.
    New search for: Liu, C. H.
    New search for: Ni, C. Y.
    New search for: Lee, S.-B.
    New search for: Kim, Y.-J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    The Design of a New Ultrasonic Horn for Flip-Chip Bonding

    New search for: Wang, W. C.
    New search for: Chen, S.
    New search for: Liu, C. H.
    New search for: Ni, C. Y.
    New search for: Lee, S.-B.
    New search for: Kim, Y.-J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    The Design of a New Ultrasonic Horn for Flip-Chip Bonding

    Contributors:

    Wang, W. C. (author) / Chen, S. (author) / Liu, C. H. (author) / Ni, C. Y. (author) / Lee, S.-B. / Kim, Y.-J.

    Published in:

    Experimental Mechanics in Nano and Biotechnology ; 505-508

    KEY ENGINEERING MATERIALS ; 326/328

    Publication date:

    2006-01-01

    Size:

    4 pages

    ISSN:

    1013-9826

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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