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High-density-plasma (HDP)-CVD oxide to thermal oxide wafer bonding for strained silicon layer transfer applications
High-density-plasma (HDP)-CVD oxide to thermal oxide wafer bonding for strained silicon layer transfer applications
High-density-plasma (HDP)-CVD oxide to thermal oxide wafer bonding for strained silicon layer transfer applications
Singh, R. (Autor:in) / Radu, I. (Autor:in) / Reiche, M. (Autor:in) / Himcinschi, C. (Autor:in) / Kuck, B. (Autor:in) / Tillack, B. (Autor:in) / Gosele, U. (Autor:in) / Christiansen, S. H. (Autor:in)
APPLIED SURFACE SCIENCE ; 253 ; 3595-3599
01.01.2007
5 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.35
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