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Electromigration behavior of the Cu/Au/SnAgCu/Cu solder combination

Chiu, T.-C. / Lin, K.-L.

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Electromigration behavior of the Cu/Au/SnAgCu/Cu solder combination

Chiu, T.-C. / Lin, K.-L.

Electromigration behavior of the Cu/Au/SnAgCu/Cu solder combination

Chiu, T.-C. / Lin, K.-L.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

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Document information

Title:

Electromigration behavior of the Cu/Au/SnAgCu/Cu solder combination

Contributors:

Chiu, T.-C. (author) / Lin, K.-L. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 23 ; 264-273

Publication date:

2008-01-01

Size:

10 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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