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    Effect of additives on the co-electrodeposition of SnAgCu lead-free solder composition

    New search for: Joseph, S.
    New search for: Phatak, G. J.

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    Effect of additives on the co-electrodeposition of SnAgCu lead-free solder composition

    New search for: Joseph, S.
    New search for: Phatak, G. J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effect of additives on the co-electrodeposition of SnAgCu lead-free solder composition

    New search for: Joseph, S.
    New search for: Phatak, G. J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Effect of additives on the co-electrodeposition of SnAgCu lead-free solder composition

    Contributors:

    Joseph, S. (author) / Phatak, G. J. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING B ADVANCED FUNCTIONAL SOLID STATE MATERIALS ; 168 ; 219-223

    Publication date:

    2010-01-01

    Size:

    5 pages

    ISSN:

    0921-5107

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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