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    Simulation of dynamic recrystallization in solder interconnections during thermal cycling

    New search for: Li, J.
    New search for: Xu, H.
    New search for: Mattila, T. T.
    New search for: Kivilahti, J. K.
    New search for: Laurila, T.
    New search for: Paulasto-Krockel, M.

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    Simulation of dynamic recrystallization in solder interconnections during thermal cycling

    New search for: Li, J.
    New search for: Xu, H.
    New search for: Mattila, T. T.
    New search for: Kivilahti, J. K.
    New search for: Laurila, T.
    New search for: Paulasto-Krockel, M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Simulation of dynamic recrystallization in solder interconnections during thermal cycling

    New search for: Li, J.
    New search for: Xu, H.
    New search for: Mattila, T. T.
    New search for: Kivilahti, J. K.
    New search for: Laurila, T.
    New search for: Paulasto-Krockel, M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Simulation of dynamic recrystallization in solder interconnections during thermal cycling

    Contributors:

    Li, J. (author) / Xu, H. (author) / Mattila, T. T. (author) / Kivilahti, J. K. (author) / Laurila, T. (author) / Paulasto-Krockel, M. (author)

    Published in:

    COMPUTATIONAL MATERIALS SCIENCE ; 50 ; 690-697

    Publication date:

    2010-01-01

    Size:

    8 pages

    ISSN:

    0927-0256

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1 / 510

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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