Effects of bump size on deformation and fracture behavior of Sn3.0Ag0.5Cu/Cu solder joints during shear testing: Fid-Bau Portal

Effects of bump size on deformation and fracture behavior of Sn3.0Ag0.5Cu/Cu solder joints during shear testing

Tian, Y. / Hang, C. / Wang, C. / Yang, S. / Lin, P.

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Effects of bump size on deformation and fracture behavior of Sn3.0Ag0.5Cu/Cu solder joints during shear testing

Tian, Y. / Hang, C. / Wang, C. / Yang, S. / Lin, P.

Effects of bump size on deformation and fracture behavior of Sn3.0Ag0.5Cu/Cu solder joints during shear testing

Tian, Y. / Hang, C. / Wang, C. / Yang, S. / Lin, P.

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

Seitennavigation

Dokumentinformationen

Ähnliche Titel

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Dokumentinformationen

Titel:

Effects of bump size on deformation and fracture behavior of Sn3.0Ag0.5Cu/Cu solder joints during shear testing

Beteiligte:

Tian, Y. (Autor:in) / Hang, C. (Autor:in) / Wang, C. (Autor:in) / Yang, S. (Autor:in) / Lin, P. (Autor:in)

Erschienen in:

MATERIALS SCIENCE AND ENGINEERING A ; 529 ; 468-478

Erscheinungsdatum:

01.01.2011

Format / Umfang:

11 pages

ISSN:

0921-5093

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

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Microstructure and size effect of interfacial intermetallic on fracture toughness of Sn3.0Ag0.5Cu solder interconnects

Wang, Shaobin / Yao, Yao / Wang, Wenjie | British Library Online Contents | 2018

Morphologies and grain orientations of Cu–Sn intermetallic compounds in Sn3.0Ag0.5Cu/Cu solder joints

Liu, W. / Tian, Y. / Wang, C. et al. | British Library Online Contents | 2012

Shear Strength in Solder Bump Joints for High Reliability Photodiode Packages

Yu, C.-H. / Kim, K.-S. / Yang, J.-M. | British Library Online Contents | 2003

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