Size and constraint effects on mechanical and fracture behavior of micro-scale Ni/Sn3.0Ag0.5Cu/Ni solder joints: Fid-Bau Portal

Size and constraint effects on mechanical and fracture behavior of micro-scale Ni/Sn3.0Ag0.5Cu/Ni solder joints

Qin, H. B. / Zhang, X. P. / Zhou, M. B. / Zeng, J. B. / Mai, Y. W.

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Size and constraint effects on mechanical and fracture behavior of micro-scale Ni/Sn3.0Ag0.5Cu/Ni solder joints

Qin, H. B. / Zhang, X. P. / Zhou, M. B. / Zeng, J. B. / Mai, Y. W.

Size and constraint effects on mechanical and fracture behavior of micro-scale Ni/Sn3.0Ag0.5Cu/Ni solder joints

Qin, H. B. / Zhang, X. P. / Zhou, M. B. / Zeng, J. B. / Mai, Y. W.

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Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Size and constraint effects on mechanical and fracture behavior of micro-scale Ni/Sn3.0Ag0.5Cu/Ni solder joints

Contributors:

Qin, H. B. (author) / Zhang, X. P. (author) / Zhou, M. B. (author) / Zeng, J. B. (author) / Mai, Y. W. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING A ; 617 ; 14-23

Publication date:

2014-01-01

Size:

10 pages

ISSN:

0921-5093

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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