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    R-curve behavior of Cu-Sn3.0Ag0.5Cu solder joints: Effect of mode ratio and microstructure

    New search for: Nadimpalli, S. P.
    New search for: Spelt, J. K.

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    R-curve behavior of Cu-Sn3.0Ag0.5Cu solder joints: Effect of mode ratio and microstructure

    New search for: Nadimpalli, S. P.
    New search for: Spelt, J. K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    R-curve behavior of Cu-Sn3.0Ag0.5Cu solder joints: Effect of mode ratio and microstructure

    New search for: Nadimpalli, S. P.
    New search for: Spelt, J. K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    R-curve behavior of Cu-Sn3.0Ag0.5Cu solder joints: Effect of mode ratio and microstructure

    Contributors:

    Nadimpalli, S. P. (author) / Spelt, J. K. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING A ; 527 ; 724-734

    Publication date:

    2010-01-01

    Size:

    11 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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