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    Microstructure and size effect of interfacial intermetallic on fracture toughness of Sn3.0Ag0.5Cu solder interconnects

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    New search for: Wang, Wenjie

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    Microstructure and size effect of interfacial intermetallic on fracture toughness of Sn3.0Ag0.5Cu solder interconnects

    New search for: Wang, Shaobin
    New search for: Yao, Yao
    New search for: Wang, Wenjie

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Microstructure and size effect of interfacial intermetallic on fracture toughness of Sn3.0Ag0.5Cu solder interconnects

    New search for: Wang, Shaobin
    New search for: Yao, Yao
    New search for: Wang, Wenjie

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Microstructure and size effect of interfacial intermetallic on fracture toughness of Sn3.0Ag0.5Cu solder interconnects

    Contributors:

    Wang, Shaobin (author) / Yao, Yao (author) / Wang, Wenjie (author)

    Published in:

    Engineering fracture mechanics ; 202 ; 259-274

    Publication date:

    2018-01-01

    Size:

    16 pages

    ISSN:

    0013-7944

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.112605

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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