Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Reliability and Bondability Study on Interfacial Behavior between SnAgCu Solder and Cu-Ni-Au OSP Pads

    New search for: Fu, S.L.
    New search for: Hsu, H.C.
    New search for: Wan, Y.M.
    New search for: Haung, C.H.
    New search for: Lai, Y.S.
    New search for: Hsu, F.Y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Reliability and Bondability Study on Interfacial Behavior between SnAgCu Solder and Cu-Ni-Au OSP Pads

    New search for: Fu, S.L.
    New search for: Hsu, H.C.
    New search for: Wan, Y.M.
    New search for: Haung, C.H.
    New search for: Lai, Y.S.
    New search for: Hsu, F.Y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Reliability and Bondability Study on Interfacial Behavior between SnAgCu Solder and Cu-Ni-Au OSP Pads

    New search for: Fu, S.L.
    New search for: Hsu, H.C.
    New search for: Wan, Y.M.
    New search for: Haung, C.H.
    New search for: Lai, Y.S.
    New search for: Hsu, F.Y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Reliability and Bondability Study on Interfacial Behavior between SnAgCu Solder and Cu-Ni-Au OSP Pads

    Contributors:

    Fu, S.L. (author) / Hsu, H.C. (author) / Wan, Y.M. (author) / Haung, C.H. (author) / Lai, Y.S. / Hsu, F.Y.

    Published in:

    Engineering Materials VII Selected, peer reviewed papers from the 7th Cross-Strait Workshop on the Engineering Materials (CSWEM 2012), November 23-24, 2012, Taiwan ; 1-8

    KEY ENGINEERING MATERIALS ; 573

    Publication date:

    2014-01-01

    Size:

    8 pages

    ISSN:

    1013-9826

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Interfacial Reaction between SnAgCu Solder and Cu Substrate and Reliability Evaluation

    Yanghua, X. / Xiaming, X. / Junling, C. | British Library Online Contents | 2005

    Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe–Ni Solder Joints

    Zhang, Hao / Zhu, Qing-Sheng / Liu, Zhi-Quan et al. | British Library Online Contents | 2014

    Interfacial microstructure evolution between eutectic SnAgCu solder and Al/Ni(V)/Cu thin films

    Li, M. / Zhang, F. / Chen, W. T. et al. | British Library Online Contents | 2002

    Recrystallization behaviour of SnAgCu solder joints

    Sundelin, J. J. / Nurmi, S. T. / Lepisto, T. K. | British Library Online Contents | 2008

    Electromigration behavior of the Cu/Au/SnAgCu/Cu solder combination

    Chiu, T.-C. / Lin, K.-L. | British Library Online Contents | 2008

    Back to top