Reliability and Bondability Study on Interfacial Behavior between SnAgCu Solder and Cu-Ni-Au OSP Pads: Fid-Bau Portal

Reliability and Bondability Study on Interfacial Behavior between SnAgCu Solder and Cu-Ni-Au OSP Pads

Fu, S.L. / Hsu, H.C. / Wan, Y.M. / Haung, C.H.

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Reliability and Bondability Study on Interfacial Behavior between SnAgCu Solder and Cu-Ni-Au OSP Pads

Fu, S.L. / Hsu, H.C. / Wan, Y.M. / Haung, C.H.

Reliability and Bondability Study on Interfacial Behavior between SnAgCu Solder and Cu-Ni-Au OSP Pads

Fu, S.L. / Hsu, H.C. / Wan, Y.M. / Haung, C.H.

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

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Dokumentinformationen

Ähnliche Titel

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Dokumentinformationen

Titel:

Reliability and Bondability Study on Interfacial Behavior between SnAgCu Solder and Cu-Ni-Au OSP Pads

Beteiligte:

Fu, S.L. (Autor:in) / Hsu, H.C. (Autor:in) / Wan, Y.M. (Autor:in) / Haung, C.H. (Autor:in) / Lai, Y.S. / Hsu, F.Y.

Erschienen in:

Engineering Materials VII Selected, peer reviewed papers from the 7th Cross-Strait Workshop on the Engineering Materials (CSWEM 2012), November 23-24, 2012, Taiwan ; 1-8

KEY ENGINEERING MATERIALS ; 573

Erscheinungsdatum:

01.01.2014

Format / Umfang:

8 pages

ISSN:

1013-9826

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

Yanghua, X. / Xiaming, X. / Junling, C. | British Library Online Contents | 2005

Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe–Ni Solder Joints

Zhang, Hao / Zhu, Qing-Sheng / Liu, Zhi-Quan et al. | British Library Online Contents | 2014

Interfacial microstructure evolution between eutectic SnAgCu solder and Al/Ni(V)/Cu thin films

Li, M. / Zhang, F. / Chen, W. T. et al. | British Library Online Contents | 2002

Recrystallization behaviour of SnAgCu solder joints

Sundelin, J. J. / Nurmi, S. T. / Lepisto, T. K. | British Library Online Contents | 2008

Electromigration behavior of the Cu/Au/SnAgCu/Cu solder combination

Chiu, T.-C. / Lin, K.-L. | British Library Online Contents | 2008

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