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COPPER/CERAMIC ASSEMBLY, INSULATED CIRCUIT BOARD, METHOD FOR PRODUCING COPPER/CERAMIC ASSEMBLY, AND METHOD FOR PRODUCING INSULATED CIRCUIT BOARD
This A copper/ceramic bonded body (10) includes: a copper member (12) made of copper or a copper alloy; and a ceramic member (11) made of oxygen-containing ceramics, wherein the copper member (12) and the ceramic member (11) are bonded to each other, a magnesium oxide layer (41) is formed on a ceramic member (11) side between the copper member (12) and the ceramic member (11), and an active metal oxide phase composed of an oxide of one or more active metals selected from Ti, Zr, Nb, and Hf is dispersed inside a copper layer (45) in contact with the magnesium oxide layer (41).
COPPER/CERAMIC ASSEMBLY, INSULATED CIRCUIT BOARD, METHOD FOR PRODUCING COPPER/CERAMIC ASSEMBLY, AND METHOD FOR PRODUCING INSULATED CIRCUIT BOARD
This A copper/ceramic bonded body (10) includes: a copper member (12) made of copper or a copper alloy; and a ceramic member (11) made of oxygen-containing ceramics, wherein the copper member (12) and the ceramic member (11) are bonded to each other, a magnesium oxide layer (41) is formed on a ceramic member (11) side between the copper member (12) and the ceramic member (11), and an active metal oxide phase composed of an oxide of one or more active metals selected from Ti, Zr, Nb, and Hf is dispersed inside a copper layer (45) in contact with the magnesium oxide layer (41).
COPPER/CERAMIC ASSEMBLY, INSULATED CIRCUIT BOARD, METHOD FOR PRODUCING COPPER/CERAMIC ASSEMBLY, AND METHOD FOR PRODUCING INSULATED CIRCUIT BOARD
KUPFER-/KERAMIKANORDNUNG, ISOLIERTE LEITERPLATTE, VERFAHREN ZUR HERSTELLUNG EINER KUPFER-/KERAMIKANORDNUNG UND VERFAHREN ZUR HERSTELLUNG EINER ISOLIERTEN LEITERPLATTE
ENSEMBLE CUIVRE/CÉRAMIQUE, CARTE DE CIRCUIT IMPRIMÉ ISOLÉE, PROCÉDÉ DE PRODUCTION D'ENSEMBLE CUIVRE/CÉRAMIQUE ET PROCÉDÉ DE PRODUCTION DE CARTE DE CIRCUIT IMPRIMÉ ISOLÉE
TERASAKI NOBUYUKI (author)
2023-10-11
Patent
Electronic Resource
English
European Patent Office | 2023
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