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COPPER/CERAMIC ASSEMBLY, INSULATED CIRCUIT BOARD, METHOD FOR PRODUCING COPPER/CERAMIC ASSEMBLY, AND METHOD FOR PRODUCING INSULATED CIRCUIT BOARD
A copper/ceramic bonded body includes: a copper member (12) made of copper or a copper alloy; and a ceramic member (11) made of nitrogen-containing ceramics, the copper member (12) and the ceramic member (11) being bonded to each other, in which a Mg solid solution layer in which Mg is solid-soluted in a Cu matrix is formed at a bonding interface between the copper member (12) and the ceramic member (11), an active metal nitride layer (41) containing a nitride of one or more active metals selected from Ti, Zr, Nb, and Hf is formed on a ceramic member (11) side, and a thickness of the active metal nitride layer (41) is set to be in a range of 0.05 µm or more and 1.2 µm or less.
COPPER/CERAMIC ASSEMBLY, INSULATED CIRCUIT BOARD, METHOD FOR PRODUCING COPPER/CERAMIC ASSEMBLY, AND METHOD FOR PRODUCING INSULATED CIRCUIT BOARD
A copper/ceramic bonded body includes: a copper member (12) made of copper or a copper alloy; and a ceramic member (11) made of nitrogen-containing ceramics, the copper member (12) and the ceramic member (11) being bonded to each other, in which a Mg solid solution layer in which Mg is solid-soluted in a Cu matrix is formed at a bonding interface between the copper member (12) and the ceramic member (11), an active metal nitride layer (41) containing a nitride of one or more active metals selected from Ti, Zr, Nb, and Hf is formed on a ceramic member (11) side, and a thickness of the active metal nitride layer (41) is set to be in a range of 0.05 µm or more and 1.2 µm or less.
COPPER/CERAMIC ASSEMBLY, INSULATED CIRCUIT BOARD, METHOD FOR PRODUCING COPPER/CERAMIC ASSEMBLY, AND METHOD FOR PRODUCING INSULATED CIRCUIT BOARD
KUPFER-/KERAMIKANORDNUNG, ISOLIERTE LEITERPLATTE, VERFAHREN ZUR HERSTELLUNG EINER KUPFER-/KERAMIKANORDNUNG UND VERFAHREN ZUR HERSTELLUNG EINER ISOLIERTEN LEITERPLATTE
ENSEMBLE CUIVRE/CÉRAMIQUE, CARTE DE CIRCUIT IMPRIMÉ ISOLÉE, PROCÉDÉ DE PRODUCTION D'ENSEMBLE CUIVRE/CÉRAMIQUE ET PROCÉDÉ DE PRODUCTION DE CARTE DE CIRCUIT IMPRIMÉ ISOLÉE
TERASAKI NOBUYUKI (author)
2023-12-13
Patent
Electronic Resource
English
| European Patent Office | 2021
| European Patent Office | 2023
| European Patent Office | 2021
| European Patent Office | 2021
| European Patent Office | 2021