A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
COPPER/CERAMIC ASSEMBLY, INSULATED CIRCUIT BOARD, METHOD FOR PRODUCING COPPER/CERAMIC ASSEMBLY, AND METHOD FOR PRODUCING INSULATED CIRCUIT BOARD
A copper-ceramic bonded body includes a copper member made of copper or a copper alloy, and a ceramic member made of silicon nitride, the copper member and the ceramic member being bonded to each other, in which a maximum length of a Mg-N compound phase which is present at a bonded interface between the copper member and the ceramic member is less than 100 nm, and in a unit length along the bonded interface, the number density of the Mg-N compound phase in a range of a length of 10 nm or more and less than 100 nm is less than 8 pieces/µm.
COPPER/CERAMIC ASSEMBLY, INSULATED CIRCUIT BOARD, METHOD FOR PRODUCING COPPER/CERAMIC ASSEMBLY, AND METHOD FOR PRODUCING INSULATED CIRCUIT BOARD
A copper-ceramic bonded body includes a copper member made of copper or a copper alloy, and a ceramic member made of silicon nitride, the copper member and the ceramic member being bonded to each other, in which a maximum length of a Mg-N compound phase which is present at a bonded interface between the copper member and the ceramic member is less than 100 nm, and in a unit length along the bonded interface, the number density of the Mg-N compound phase in a range of a length of 10 nm or more and less than 100 nm is less than 8 pieces/µm.
COPPER/CERAMIC ASSEMBLY, INSULATED CIRCUIT BOARD, METHOD FOR PRODUCING COPPER/CERAMIC ASSEMBLY, AND METHOD FOR PRODUCING INSULATED CIRCUIT BOARD
KUPFER-/KERAMIKANORDNUNG, ISOLIERTE LEITERPLATTE, VERFAHREN ZUR HERSTELLUNG EINER KUPFER-/KERAMIKANORDNUNG UND VERFAHREN ZUR HERSTELLUNG EINER ISOLIERTEN LEITERPLATTE
ENSEMBLE CUIVRE/CÉRAMIQUE, CARTE DE CIRCUIT IMPRIMÉ ISOLÉE, PROCÉDÉ DE PRODUCTION D'ENSEMBLE CUIVRE/CÉRAMIQUE ET PROCÉDÉ DE PRODUCTION DE CARTE DE CIRCUIT IMPRIMÉ ISOLÉE
TERASAKI NOBUYUKI (author)
2023-12-27
Patent
Electronic Resource
English
| European Patent Office | 2021
| European Patent Office | 2021
| European Patent Office | 2023
| European Patent Office | 2023
| European Patent Office | 2021