A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
COPPER/CERAMIC JOINT AND INSULATED CIRCUIT BOARD
To provide a copper/ceramic joint and an insulated circuit board in which a copper member made of copper or a copper alloy and a ceramic member are reliably bonded to each other and have excellent bonding reliability even when ultrasonic waves are applied.SOLUTION: In a copper/ceramic joint made by joining a copper member made of copper or a copper alloy and a ceramic member, as a result of observing the cross section along the laminating direction of a copper member, the ratio D1/D0 of the average crystal grain size D1 at a position of 50 μm in the laminating direction from the bonding surface with the ceramic member and the average crystal grain size D0 of the entire copper member is 0.60 or less.SELECTED DRAWING: None
【課題】銅又は銅合金からなる銅部材とセラミックス部材とが確実に接合され、超音波を付与した際にも接合信頼性に優れた銅／セラミックス接合体、および、絶縁回路基板を提供する。【解決手段】銅又は銅合金からなる銅部材と、セラミックス部材とが接合されてなる銅／セラミックス接合体であって、前記銅部材の積層方向に沿った断面を観察した結果、前記セラミックス部材との接合面から積層方向に５０μｍの位置における平均結晶粒径Ｄ１と前記銅部材の全体の平均結晶粒径Ｄ０との比Ｄ１／Ｄ０が０．６０以下である。【選択図】なし
COPPER/CERAMIC JOINT AND INSULATED CIRCUIT BOARD
To provide a copper/ceramic joint and an insulated circuit board in which a copper member made of copper or a copper alloy and a ceramic member are reliably bonded to each other and have excellent bonding reliability even when ultrasonic waves are applied.SOLUTION: In a copper/ceramic joint made by joining a copper member made of copper or a copper alloy and a ceramic member, as a result of observing the cross section along the laminating direction of a copper member, the ratio D1/D0 of the average crystal grain size D1 at a position of 50 μm in the laminating direction from the bonding surface with the ceramic member and the average crystal grain size D0 of the entire copper member is 0.60 or less.SELECTED DRAWING: None
【課題】銅又は銅合金からなる銅部材とセラミックス部材とが確実に接合され、超音波を付与した際にも接合信頼性に優れた銅／セラミックス接合体、および、絶縁回路基板を提供する。【解決手段】銅又は銅合金からなる銅部材と、セラミックス部材とが接合されてなる銅／セラミックス接合体であって、前記銅部材の積層方向に沿った断面を観察した結果、前記セラミックス部材との接合面から積層方向に５０μｍの位置における平均結晶粒径Ｄ１と前記銅部材の全体の平均結晶粒径Ｄ０との比Ｄ１／Ｄ０が０．６０以下である。【選択図】なし
COPPER/CERAMIC JOINT AND INSULATED CIRCUIT BOARD
銅／セラミックス接合体、および、絶縁回路基板
TAKAKUWA SATOSHI (author) / TERASAKI NOBUYUKI (author) / NISHIMOTO SHUJI (author)
2021-12-13
Patent
Electronic Resource
Japanese
| European Patent Office | 2021
| European Patent Office | 2021
| European Patent Office | 2021