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    Wet-Etching Characteristics of SiCN Films Deposited by HWCVD Method

    New search for: Nakanishi, H.
    New search for: Ogata, T.
    New search for: Kadotani, Y.
    New search for: Izumi, A.
    New search for: Vincenzini, P.
    New search for: Lorenzelli, L.

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    Wet-Etching Characteristics of SiCN Films Deposited by HWCVD Method

    New search for: Nakanishi, H.
    New search for: Ogata, T.
    New search for: Kadotani, Y.
    New search for: Izumi, A.
    New search for: Vincenzini, P.
    New search for: Lorenzelli, L.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Wet-Etching Characteristics of SiCN Films Deposited by HWCVD Method

    New search for: Nakanishi, H.
    New search for: Ogata, T.
    New search for: Kadotani, Y.
    New search for: Izumi, A.
    New search for: Vincenzini, P.
    New search for: Lorenzelli, L.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

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    Check availability in my library
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    Document information
    Title:

    Wet-Etching Characteristics of SiCN Films Deposited by HWCVD Method

    Contributors:

    Nakanishi, H. (author) / Ogata, T. (author) / Kadotani, Y. (author) / Izumi, A. (author) / Vincenzini, P. / Lorenzelli, L.

    Conference:

    Symposium, Next generation micro/nano systems; of CIMTEC 2012 ``Smart materials, structures and systems'' ; 2012 ; Montecatini Terme, Italy

    Published in:

    Next generation micro/nano systems; of CIMTEC 2012 ``Smart materials, structures and systems'' ; 34-38

    ADVANCES IN SCIENCE AND TECHNOLOGY ; 81

    Publication date:

    2013-01-01

    Size:

    5 pages

    Remarks:

    Includes bibliographical references and index

    ISBN:

    9783908158677

    ISSN:

    1662-8969

    Type of media:

    Conference paper

    Type of material:

    Print

    Language:

    English

    Keywords:

    Next generation micro systems , Nano systems , CIMTEC

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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