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Interface Defects of Bonded Silicon Wafers

Reiche, M. / Tong, Q.-Y. / Goesele, U. / Heydenreich, J.

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Interface Defects of Bonded Silicon Wafers

Reiche, M. / Tong, Q.-Y. / Goesele, U. / Heydenreich, J.

Interface Defects of Bonded Silicon Wafers

Reiche, M. / Tong, Q.-Y. / Goesele, U. / Heydenreich, J.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Interface Defects of Bonded Silicon Wafers

Contributors:

Reiche, M. (author) / Tong, Q.-Y. (author) / Goesele, U. (author) / Heydenreich, J. (author)

Published in:

MATERIALS SCIENCE FORUM ; 1847-1852

Publication date:

1995-01-01

Size:

6 pages

ISSN:

0255-5476

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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