Characterization of interfacial reactions between ionized metal plasma deposited Al-0.5 wt.% Cu and Ti on SiO2: Fid-Bau Portal

Characterization of interfacial reactions between ionized metal plasma deposited Al-0.5 wt.% Cu and Ti on SiO2

Lee, Y. K. / Maung Latt, K. / Li, S. / Osipowicz, T. / Chiam, S. Y.

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Characterization of interfacial reactions between ionized metal plasma deposited Al-0.5 wt.% Cu and Ti on SiO2

Lee, Y. K. / Maung Latt, K. / Li, S. / Osipowicz, T. / Chiam, S. Y.

Characterization of interfacial reactions between ionized metal plasma deposited Al-0.5 wt.% Cu and Ti on SiO2

Lee, Y. K. / Maung Latt, K. / Li, S. / Osipowicz, T. / Chiam, S. Y.

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Document information

Title:

Characterization of interfacial reactions between ionized metal plasma deposited Al-0.5 wt.% Cu and Ti on SiO2

Contributors:

Lee, Y. K. (author) / Maung Latt, K. (author) / Li, S. (author) / Osipowicz, T. (author) / Chiam, S. Y. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING -LAUSANNE- B ; 77 ; 101 - 105

Publication date:

2000-01-01

Size:

5 pages

ISSN:

0921-5107

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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