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Study of interfacial reactions in ionized metal plasma (IMP) deposited Al-0.5%wt Cu/Ti/SiO~2/Si structure
Study of interfacial reactions in ionized metal plasma (IMP) deposited Al-0.5%wt Cu/Ti/SiO~2/Si structure
Study of interfacial reactions in ionized metal plasma (IMP) deposited Al-0.5%wt Cu/Ti/SiO~2/Si structure
Lee, Y. K. (author) / Latt, K. M. (author) / Jaehyung, K. (author) / Osipowicz, T. (author) / Chiam, S.-Y. (author) / Lee, K. (author)
JOURNAL OF MATERIALS SCIENCE ; 35 ; 5857-5860
2000-01-01
4 pages
Article (Journal)
English
DDC:
620.11
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