Thermal stability of boron electrical activation in preamorphised ultra-shallow junctions: Fid-Bau Portal

Thermal stability of boron electrical activation in preamorphised ultra-shallow junctions

Cristiano, F. / Cherkashin, N. / Calvo, P. / Lamrani, Y. / Hebras, X. / Claverie, A. / Lerch, W. / Paul, S.

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Thermal stability of boron electrical activation in preamorphised ultra-shallow junctions

Cristiano, F. / Cherkashin, N. / Calvo, P. / Lamrani, Y. / Hebras, X. / Claverie, A. / Lerch, W. / Paul, S.

Thermal stability of boron electrical activation in preamorphised ultra-shallow junctions

Cristiano, F. / Cherkashin, N. / Calvo, P. / Lamrani, Y. / Hebras, X. / Claverie, A. / Lerch, W. / Paul, S.

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Title:

Thermal stability of boron electrical activation in preamorphised ultra-shallow junctions

Contributors:

Cristiano, F. (author) / Cherkashin, N. (author) / Calvo, P. (author) / Lamrani, Y. (author) / Hebras, X. (author) / Claverie, A. (author) / Lerch, W. (author) / Paul, S. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING B -LAUSANNE- ; 114/115 ; 174-179

Publication date:

2004-01-01

Size:

6 pages

ISSN:

0921-5107

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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Lerch, W. / Paul, S. / Niess, J. et al. | British Library Online Contents | 2005

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