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Superior thermal stability of Ta/TaN bi-layer structure for copper metallization

Xie, Q. / Qu, X. P. / Tan, J. J. / Jiang, Y. L. / Zhou, M. / Chen, T. / Ru, G. P.

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Superior thermal stability of Ta/TaN bi-layer structure for copper metallization

Xie, Q. / Qu, X. P. / Tan, J. J. / Jiang, Y. L. / Zhou, M. / Chen, T. / Ru, G. P.

Superior thermal stability of Ta/TaN bi-layer structure for copper metallization

Xie, Q. / Qu, X. P. / Tan, J. J. / Jiang, Y. L. / Zhou, M. / Chen, T. / Ru, G. P.

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Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Superior thermal stability of Ta/TaN bi-layer structure for copper metallization

Contributors:

Xie, Q. (author) / Qu, X. P. (author) / Tan, J. J. (author) / Jiang, Y. L. (author) / Zhou, M. (author) / Chen, T. (author) / Ru, G. P. (author)

Published in:

APPLIED SURFACE SCIENCE ; 253 ; 1666-1672

Publication date:

2006-01-01

Size:

7 pages

ISSN:

0169-4332

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.35

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