A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
SPUTTERING TARGET AND METHOD FOR MANUFACTURING SPUTTERING TARGET
Provided are a sputtering target in which the occurrence of particles can be reduced, and which has improved uniformity, and a method for manufacturing the sputtering target. The sputtering target is characterized by including 10 mol% to 85 mol% Co, 0 mol% to 47 mol% Pt, and 0 mol% to 47 mol% Cr as metal components, and by including at least B6O as an oxide component.
本发明提供一种能减少颗粒的产生的、更均质的溅射靶及其制造方法。一种溅射靶，其特征在于，包含10mol％以上且85mol％以下的Co、0mol％以上且47mol％以下的Pt、0mol％以上且47mol％以下的Cr作为金属成分，至少包含B6O作为氧化物成分。
SPUTTERING TARGET AND METHOD FOR MANUFACTURING SPUTTERING TARGET
Provided are a sputtering target in which the occurrence of particles can be reduced, and which has improved uniformity, and a method for manufacturing the sputtering target. The sputtering target is characterized by including 10 mol% to 85 mol% Co, 0 mol% to 47 mol% Pt, and 0 mol% to 47 mol% Cr as metal components, and by including at least B6O as an oxide component.
本发明提供一种能减少颗粒的产生的、更均质的溅射靶及其制造方法。一种溅射靶，其特征在于，包含10mol％以上且85mol％以下的Co、0mol％以上且47mol％以下的Pt、0mol％以上且47mol％以下的Cr作为金属成分，至少包含B6O作为氧化物成分。
SPUTTERING TARGET AND METHOD FOR MANUFACTURING SPUTTERING TARGET
溅射靶以及溅射靶的制造方法
FURUYA YUKI (author)
2021-11-23
Patent
Electronic Resource
Chinese
SPUTTERING TARGET AND SPUTTERING TARGET MANUFACTURING METHOD
| European Patent Office | 2020
SPUTTERING TARGET AND SPUTTERING TARGET MANUFACTURING METHOD
| European Patent Office | 2020
SPUTTERING TARGET AND SPUTTERING TARGET MANUFACTURING METHOD
| European Patent Office | 2020
SPUTTERING TARGET AND MANUFACTURING METHOD OF SPUTTERING TARGET
| European Patent Office | 2020
SPUTTERING TARGET AND METHOD OF MANUFACTURING SPUTTERING TARGET
| European Patent Office | 2020